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About Gonign
Certificate Approval
Core Capabilities

  • 1991,Asias only success in developing Easy Open End progressive stamping dies.
  • 1992,Developed multi-pillar, and multi-cylinder IC packaging molds.
  • 1994,Taiwans only success in developing 3.5 inches floppy disk components toolings.
  • 1995,Developed IC leadframe tooling and production techniques.
  • 1996,Developed one piece forming technique instead of two piece welded technique for gas turbine engine seal segment.
  • 1998,Developed roll form technique for combustion liners of gas turbine engines.
  • 1999,Developed stamping technique for compressor vanes of gas turbine engines.
  • 2000,Developed 8" wafer posting and cooling system.
  • 2001,Developed 12" single wafer load-lock system.
  • 2002,Developed etching chamber for wafer processing.


                       

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